engineering in the Wet process areas (CMP, Liftoff, Wet Etch. Electroplating) in a high-volume 24x7 wafer fabrication environment..., procurement, introduction, and qualification of new Wet process tools, materials, and consumables. Support the development...
engineering in the Wet process areas (CMP, Liftoff, Wet Etch. Electroplating) in a high-volume 24x7 wafer fabrication environment..., procurement, introduction, and qualification of new Wet process tools, materials, and consumables. Support the development...