_ THE ROLE: The job role will be responsible for advanced 2.5D & 3D IC packaging technology evaluation, design enablement... advanced packaging technology and drive system-technology co-optimization (STCO) of FPGA and ASIC products at advanced nodes...
Product Engineer, you will be responsible for driving innovation and expanding Cadence IC Packaging Advanced Routing..., with focus on Advanced IC Package Routing, Technologies, and Flows. Location; San Jose, CA, on-site. As an IC Packaging...
Product Engineer, you will be responsible for driving innovation and expanding Cadence IC Packaging Advanced Routing..., with focus on Advanced IC Package Routing, Technologies, and Flows. Location San Jose, CA, on-site. As an IC Packaging...