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Keywords: Packaging Module Development Engineer, Location: Phoenix, AZ

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Packaging Module Development Engineer

solutions and scales them for high-volume manufacturing. The Packaging Module Development Engineer will contribute... is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge...

Company: Intel
Location: Phoenix, AZ
Posted Date: 07 Jan 2026
Salary: $133800 - 188890 per year

Packaging Module Development Engineer

systems, and methods and continuously engages with packaging technology development and partner engineering groups on process... development and test technology. Passionate about helping colleagues and partners to deliver higher-quality software. Excited...

Company: Intel
Location: Phoenix, AZ
Posted Date: 11 Jan 2026
Salary: $133800 - 188890 per year

Packaging Module Development Engineer

learning to solve complex semiconductor packaging manufacturing challenges. Microelectronic Packaging Engineers provide... project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies...

Company: Intel
Location: Phoenix, AZ
Posted Date: 09 Jan 2026
Salary: $85200 - 139810 per year

Shift 7 Module Engineer On Shift (MEOS)

). Become a part of Intel's Advanced Packaging Team by joining the Advanced Packaging Technology Development: Substrate and Wafer... role of a Module Engineer On Shift (MEOS) is to provide factory support by handling equipment, process and product issues...

Company: Intel
Location: Phoenix, AZ
Posted Date: 06 Dec 2025
Salary: $80310 - 156540 per year

TD Media and Collaterals Development Engineer

selection and prototype development to meet assembly module needs, based on fundamental understanding of failure mechanisms... prototypes, and methods and continuously engages with packaging technology development and partner engineering groups on process...

Company: Intel
Location: Phoenix, AZ
Posted Date: 14 Jan 2026
Salary: $115110 - 162500 per year