Semiconductor Packaging. Education: MS or PhD in Electrical, Mechanical Engineering, Material Engineering or equivalent... Technical Expertise: wafer to wafer bonding - including fusion and hybrid bonding, complex heterogeneous wafer level packaging...
& Development: Define, develop, and optimize advanced packaging process flows (e.g., TSV, RDL, bump, hybrid bonding, die stacking...). Cross-Functional Collaboration: Lead technical projects to integrate packaging needs into product designs, ensuring Design...