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Keywords: Package Layout Design Intern, Location: Bucharest

Page: 1

Package Layout Design Intern

applications. The package engineering group is responsible of the IC package interconnect design and electrical/thermo-mechanical... verifications, for various circuits going into various customer applications. What You Can Expect Design flip-chip package...

Company: Marvell
Location: Bucharest
Posted Date: 29 Jan 2026

Package Design Intern

) using 3D EM simulation tools. Interact with PKG Layout Design team to optimize package electrical performance from Signal... applications. The package engineering group is responsible of the IC package interconnect design and electrical/thermo-mechanical...

Company: Marvell
Location: Bucharest
Posted Date: 31 Jan 2026