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Keywords: Global Quality IC Package Design/Development Quality Assurance Principal Engineer, Location: Boise, ID

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Global Quality IC Package Design/Development Quality Assurance Principal Engineer

package design, manufacturing, or Quality & Reliability (Q&R). Experience with advanced packaging technologies (e.g., 3DI...Execute technical risk assessment and NUDD (New, Unique, Different, Difficult) analysis for new designs/design rules...

Company: Micron
Location: Boise, ID
Posted Date: 19 Dec 2025