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Keywords: ASIC Chip Design Lead, Location: Boise, ID

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ASIC Chip Design Lead

Job Title: ASIC Chip Design Lead Full-time / Contract W2 with Benefits + Bonus Location: Remote... Integration. As a Chip Lead you will give direction to other engineers and participate in developing state-of-the-art features...

Company: Encore Semi
Location: Boise, ID
Posted Date: 22 Feb 2026

ASIC Chip Design Lead

Job Title: ASIC Chip Design Lead Full-time / Contract W2 with Benefits + Bonus Location: Remote... Integration. As a Chip Lead you will give direction to other engineers and participate in developing state-of-the-art features...

Company: Encore Semi
Location: Boise, ID
Posted Date: 21 Feb 2026

ASIC System on Chip Architect

lead of a cross-functional team (hardware engineering, software developers, verification engineers) to define, design..., simulate, fabricate and iterate a RISC-V Application-Specific Integrated Circuit (ASIC) System on a Chip (SoC) product...

Posted Date: 09 Jan 2026

ASIC Digital Design Engineering Lead

. What You’ll Get to Do: Lead a team of digital design engineers to create a security system on a chip. Collaborate with team... through novel CPU design, crypto cores, purpose-built system-on-a-chip architectures and hardened operating systems...

Company: Idaho Scientific
Location: Boise, ID
Posted Date: 10 Jan 2026

Sr ASIC Packaging Engineer - (Remote)

Architecture: Design and develop advanced ASIC packaging solutions, including 2.5D/3D IC (HBM/CoWoS), Flip-Chip BGA, and Fan-Out...Sr ASIC Packaging Engineer - (100% Remote) We are seeking a Sr ASIC Packaging Engineer to lead the physical...

Company: Encore Semi
Location: Boise, ID
Posted Date: 08 Mar 2026
Salary: $135000 - 150000 per year

Sr ASIC Packaging Engineer – (Remote)

Architecture: Design and develop advanced ASIC packaging solutions, including 2.5D/3D IC (HBM/CoWoS), Flip-Chip BGA, and Fan-Out...Sr ASIC Packaging Engineer – (100% Remote) We are seeking a Sr ASIC Packaging Engineer to lead the physical...

Company: Encore Semi
Location: Boise, ID
Posted Date: 08 Mar 2026
Salary: $135000 - 150000 per year

Sr ASIC Packaging Engineer (Remote)

Architecture: Design and develop advanced ASIC packaging solutions, including 2.5D/3D IC (HBM/CoWoS), Flip-Chip BGA, and Fan-Out...Sr ASIC Packaging Engineer - (100% Remote) We are seeking a Sr ASIC Packaging Engineer to lead the physical...

Company: Encore Semi
Location: Boise, ID
Posted Date: 07 Mar 2026
Salary: $135000 - 150000 per year

Sr ASIC Packaging Engineer (Remote)

Architecture: Design and develop advanced ASIC packaging solutions, including 2.5D/3D IC (HBM/CoWoS), Flip-Chip BGA, and Fan-Out...Sr ASIC Packaging Engineer – (100% Remote) We are seeking a Sr ASIC Packaging Engineer to lead the physical...

Company: Encore Semi
Location: Boise, ID
Posted Date: 07 Mar 2026
Salary: $135000 - 150000 per year