Heterogeneous Integration (3D-HI) initiatives spanning multiple application domains. Essential Responsibilities: Drive 3D-HI... Heterogeneous Integration (3D-HI) processes. Drive end-to-end process integration and planning to enable new capabilities and early...
I/O. Drive heterogeneous integration (HI) of photonic and electronic components using 2.5D/3D/3.5D packaging technologies (e.g... and heterogeneous integration (HI) for AI, HPC, and data center applications. With a global manufacturing footprint spanning three...
and heterogeneous integration (HI) for AI, HPC, and data center applications. With a global manufacturing footprint spanning three... to shape their markets. For more information, visit . Summary of Role: This hands-on packaging assembly integration role...