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Keywords: Senior Engineer, Advanced Packaging Integration Engineering, Location: Singapore

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Senior Engineer, Advanced Packaging Integration Engineering

Your responsibilities include but are not limited to developing and enabling deployment of advanced packaging...: Develop and enable advanced package technology for various post-fab wafer finish and assembly processes Focus on improving...

Company: Micron
Location: Singapore
Posted Date: 01 Feb 2026

Senior MTS, Advanced Packaging Integration

, or wherever you may go. Learn more about our . About the Role We are seeking a highly skilled Advanced Packaging Integration... Engineer to join the Applied Materials Advanced Packaging Disruptive Technology team. This role focuses on advanced advanced...

Location: Singapore
Posted Date: 27 Nov 2025

Senior Staff R&D Design Technology Integration Engineer (WLP, Bump, Die Sort)

At least 5 years direct experience in process engineering, product integration or quality management at tier 1 foundries...Company: Qualcomm Asia Pacific Pte. Ltd. Job Area: Engineering Group, Engineering Group Hardware Engineering...

Company: Qualcomm
Posted Date: 31 Jan 2026

Front End Central Product Integration - Chip Interaction Senior Engineer/Engineer

experience on DRAM HPM, BEOL integration, advanced packaging and layout will be a plus to this job position. Good data analysis... and execution, network BKM leveraging and enhancement, and business process creation and re-engineering. Define strategies to ensure...

Company: Micron
Location: Singapore
Posted Date: 10 Dec 2025

FE CPIE CPI Senior Engineer/Engineer

experience on DRAM HPM, BEOL integration, advanced packaging and layout will be a plus to this job position. Good data analysis... and execution, network BKM leveraging and enhancement, and business process creation and re-engineering. Define strategies to ensure...

Company: Micron
Location: Singapore
Posted Date: 12 Dec 2025

HPC Systems Engineer

of semiconductors. Customers from the foundry, logic, memory, automotive, MEMS, advanced packaging and other markets rely upon high... (frontside, backside, and edge) macro inspection that is critical for automotive IC, MEMS, and advanced packaging processes...

Company: KLA Corporation
Location: Singapore
Posted Date: 07 Feb 2026

System Design Engineer (Hardware)

and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel...-effectively. Enabling the movement towards advanced chip design, KLA's Global Products Group (GPG), which is responsible...

Company: KLA Corporation
Location: Singapore
Posted Date: 24 Dec 2025

System Design Engineer

and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel...-effectively. Enabling the movement towards advanced chip design, KLA's Global Products Group (GPG), which is responsible...

Company: KLA Corporation
Location: Singapore
Posted Date: 24 Dec 2025